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We are pleased to announce that the June 2024 issue of the IEEE Transactions on Dielectrics and Electrical Insulation (TDEI) will be a special issue focusing on electrets and related phenomena. This issue is open to all authors and paper presenters at the 19th Annual IEEE International Symposium on Electrets (ISE19) between September 18-22, 2023, in Linz (Austria), and authors are especially encouraged to submit their work for this special issue.

Topics include - but are not limited to:

• Charge related phenomena in dielectrics (charge injection, transport & trapping)
• Thermally stimulated current & dielectric relaxation
• Nanoscale measurements of electrostatic phenomena
• Ferroelectric, piezoelectric & pyroelectric phenomena
• Ferroelectrets & photoelectrets
• Electrostatic & dielectric phenomena in life science: bioelectrets
• Non-linear electrical & optical effects
• Applications of thin-film ferroelectric materials
• Electrets in organic electronics
• Soft actuators & sensors
• Functional materials and dielectrics

Authors are invited to submit their manuscripts to the IEEE TDEI submission portal https://ieee.atyponrex.com/journal/tdei, opens an external URL in a new window. During the first step of the submission process, authors will be able to choose the name of the intended special issue. Instructions to prepare manuscripts and templates in MSWord and LaTeX are available at: https://ieeedeis.org/publications/transactions-on-dielectrics-and-electrical-insulation/, opens an external URL in a new window.

In accordance with IEEE policy, papers that have been published in any conference proceedings cannot be republished. A plagiarism tool will be used to verify original content. A minimum of two reviewers will peer review all of the submissions. Accepted papers will be available online within 10 days as Early View Papers in IEEE Xplore.

The submission deadline for manuscripts is November 30, 2023. If you have any questions about this special issue, please contact one of the three guest editors or contact the IEEE Transaction on Dielectrics and Electrical Insulation editor-in-chief, Professor Michael Wübbenhorst (michael.wubbenhorst(at)kuleuven.be), directly. The guest editors for this special issue include: Martin Kaltenbrunner (martin.kaltenbrunner(at)jku.at), Dmitry Rychkov (dmitry.rychkov(at)th-deg.de), and Reinhard Schwödiauer (reinhard.schwoediauer(at)jku.at).